Product information

IC card module peeling inspection device

【Inspection unit】

We will give you "absolute peace of mind" after shipping.

Apply stress to the IC card in the long side direction and short side direction,
It is a device that detects poor adhesion of the IC card module mounted on the contact type IC card. (Patent pending for detection method)

Through such inspections, we detect "modules that may come off in the future" and provide a great sense of security when shipping IC cards used in harsh situations.
Specification
Basic functions
Bending (long side direction / short side direction) + adhesion defect inspection
Bending (long side direction / short side direction) + polling inspection
Bending (long side direction / short side direction) + DC characteristic inspection
Inspection of module appearance (scratches / color unevenness) for contact type IC cards
Reference external dimensions
Body: 2800W x 1800H x 900D (mm)
Required equipment
Three-phase 200V 30A
Air 0.5Mpa 70L / min